Farantin gogewa na alumina na 99.7% na CMP

Chemshunfarantin gogewa na alumina wafer/Teburin juyawa an yi shi ne da tsantsar alumina mai ƙarfi 99.7-99.9%. Yumbu mai ƙarfi na alumina yana da matuƙar tauri da juriya ga lalacewa don goge wafer kuma yana kiyaye kyakkyawan siffar saman na tsawon lokaci. PIBM ne ya siffanta shi. Memba ne a masana'antar semiconductor saboda kwanciyar hankali da yanayin zafi mara misaltuwa da juriya ga yanayin kayan aikin sarrafa ƙananan na'urori masu ƙarfi.

Tsarin Sinadarai-Mechanical Planarization (CMP), wanda kuma aka sani da Chemical-Mechanical Polishing, fasaha ce a cikin tsarin kera na'urorin semiconductor. Yana amfani da lalata sinadarai da ƙarfin injiniya don daidaita wafers na silicon ko wasu kayan substrate yayin sarrafawa.

Kayan aikin CMP galibi an raba su zuwa sassa biyu: ɓangaren gogewa da ɓangaren tsaftacewa. Sashen gogewa ya ƙunshi sassa 4, wato tebura 3 na gogewa da kuma tsarin lodawa da sauke wafer. Sashen tsaftacewa yana da alhakin tsaftacewa da busar da wafer don cimma "bushewa da bushewa" na wafer. A cikin dukkan kayan gogewa, yumburan alumina suna taka muhimmiyar rawa.

Yawanci ana amfani da yumburan alumina don shirya faifan goge wafer, waɗanda ke buƙatar tsarki mai yawa, juriya mai yawa ga sinadarai, da kuma kyakkyawan kula da siffar saman da kuma ƙazanta.

Faifan niƙa na Chemshun 99.7% Al2O3 an yi shi ne da kayan yumbu na zamani, wanda ya dace da niƙa mai kyau na kayan aiki daban-daban, musamman don niƙa kayan da suka lalace kamar wafers, yumbu da gilashi. Faifan niƙa na yumbu ɗinmu ana iya yin shi zuwa girma dabam-dabam bisa ga nau'ikan niƙa da gogewa daban-daban.